Bridge the Package Innovation Gap Between InterPack and PACK EXPO
- Published: October 21, 2008
WEST CHESTER, PA | Packaging professionals seeking to bridge the gap between the technologies and innovations displayed six months ago at the triennial InterPack Fair in Germany, and who are planning to attend the biennial PACKEXPO this November, can reference the InterPack Innovations Report as a comparative, competitive information resource.
The Interpack Innovations Report: Actionable Insights & Opportunities—2008—2011, was published just 30 days following the close of InterPack 2008, making it still the most timely report on package innovation of its type. The report contains 130 pages profiling 100 package technology, process, and service innovations; each profiled innovation has been vetted by the InterPack Innovations Team from Packaging & Technology Integrated Solutions. This team was lead by PTIS principles Dr. Mike Richmond and Brian Wagner, and included two Packaging Hall of Fame members.
Included in the report are:
• Profiles detailing incremental, discontinuous, and disruptive package technology, process, and service innovations. The selected technologies were culled and qualified from among the thousands of general package technology offerings displayed by the 2,744 exhibitors using a unique Innovation Ratings Scale.
• A variety of supporting documentation, including illustrations, photographs, industry trends data, and video interviews available for downloadable viewing.
• Insights & Analysis by the InterPack Innovations Team, which has put the technologies in context with retail, consumer, and supply chain trends issues, challenges, and opportunities in a way that enables readers to take action.
To order your copy of the Interpack Innovations Report, contact Karen at 610-436-4220 (ext. 8511), email at This email address is being protected from spambots. You need JavaScript enabled to view it., or order online at www.packstrat.com.
