AWA’s IMLCON and IMDCON Coming Up

Published: August 10, 2012

AMSTERDAM, THE NETHERLANDS | AWA Conferences & Events, organized by AWA Alexander Watson Assoc., announces the IMLCON and IMDCON Conference and Exhibition, October 4–5, 2012, at the Hyatt Rosemont Hotel just outside of Chicago. The international event, featuring in-mold labeling and product decoration, targets material suppliers, converters, machine producers, technology suppliers, and brand owners. End-users are invited to take up the organizers’ offer to participate in the event free of charge.

The formal conference agenda offers a program of expert papers:

• An in-depth overview of the current status of the in-mold labeling market—Corey M Reardon, president and CEO of AWA

• A discussion of the interaction between packaging and the consumer—Dr. Laura Bix, Michigan State University’s School of Packaging

• A report on eco-design for packaging in the circular economy—Mark Shayler, Tickety Boo environmental consultancy

• A discussion on whether sustainable packaging is a myth or a reality—Ian Murdoch, PwC

• Retail shelf ‘stand-out’ for product packaging and how the choices in IML materials and capabilities can enhance it—Bill Hewitt, Yupo USA

• The IML/IMD odyssey and the challenges it presents for designers, project managers, and processors—Mark Dirr, XTEN Industries

• A recent breakthrough in removable in-mold labels—Stephen Boyd, Systems Labelling

• The value of removable in-mold labels in the recycling arena—Keith Bechard, Entropex (http://www.entropex.com/)

• How thin-wall and barrier applications for IML are now justifying the use of the technology in many new product areas—Jes Gram, Gram Technology

• Direct-to-product inkjet and its likely future in product identification and decoration—Clayton Sampson, Cyan Tec.

Completing the program are a panel discussion, networking breaks, visits to the complementary exhibition, and a cocktail reception on the first evening courtesy of Platinum Event Sponsors Marbach.

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