TAPPI Now Accepting Abstracts for the 2008 PLACE Conference
- Published: January 07, 2008, By pffc-online.com
PRESS RELEASE
Introduce your latest innovation, development, or research to the industry during the 2008 PLACE Conference September 14-17, 2008. Sponsored by TAPPI's Polymers, Laminations, Adhesives, Coatings and Extrusions (PLACE) div., this conference will attract industry professionals from all areas of the flexible packaging and converting industries.
The 2008 program will focus on innovations in flexible consumer packaging. Key topics will include:
- Brand owner presentations.
- Sustainability.
- Biodegradable packaging.
- Nanotechnology.
- Intelligent/smart packaging.
- Barrier innovations.
- Food safety.
- Converting solutions.
- Performance packaging.
- Productivity enhancement.